Thanks to a new patent listing, we have learned some details on what the Playstation 5’s cooling system could work like.
This patient reads as follows:
“A heatsink is disposed on a lower surface of a circuit board. The circuit board has through holes that penetrate the circuit board in an area where an integrated circuit apparatus is disposed. Heat conduction paths are provided in the through holes. The heat conduction paths connect the integrated circuit apparatus 5 and the heatsink. This structure allows for disposition of a component different from the heatsink on the same side as the integrated circuit apparatus, thus ensuring a higher degree of freedom in a component layout.”
